Chemical Etch Thermal Conductivity DBC Ceramic Substrate
Chemical Etch Thermal Conductivity DBC Ceramic Substrate DBC Ceramic Substrate can be applied in various kinds of packaging of electronic module with possibility to etch various kinds of pattern on copper surface. At high temperatures, a copper foil substrate is bonded directly to the surface (single or double sided) of an AI203 OR AIN ceramic substrate. It is a green product without pollution and public harm, which also has a wide range of operating temperature. This substrate has many superiorities, for example, it is highly resistant to vibration and wear, ensuring its long service life. Also, A large number of high-voltage, high-power devices have high requirements for heat dissipation, and ceramic substrates have a better heat dissipation effect. Moreover, it has excellent electrical insulation performance, excellent soft brazability, high adhesion strength and a large current-carrying capacity. It is widely used in many fields, including electronic heater, automot…
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